FixedFocus revealed that Huawei still has many Kirin 8000 products in the pipeline. The processor could be used in new MatePad tablets and the upcoming Enjoy series. The company will probably unveil these devices by the end of this year.

On October 30, Huawei quietly unveiled the MatePad 11.5 2024 tablet. The company didn’t reveal the chipset info. However, an early leak suggested that the device uses Kirin 8000. It seems the OEM is planning more new products with the same chip.

The leak doesn’t specify any release time for these products. Yet, Huawei will likely unveil a new tablet and another Enjoy series before wrapping up this year.

Huawei hasn’t confirmed the news yet. Hence, let’s take this input with a grain of salt and wait for the official statements on this matter.

Huawei may launch more new Kirin 8000 products this year (Image Credits: FixedFocus/Weibo)

Kirin 8000 debuted with the Nova 12 Pro handset in December last year. It is an octa-core chipset that is inferior to Kirin 9000SL but promises better performance than the previous-generation Kirin 8 processors, for the mid-range lineup.

The chipset contains a 4+3+1 CPU architecture. It has four 1.84GHz small cores, three 2.19GHz medium cores, and one 2.40GHz large core. The chip is paired with Maleoon 910 GPU and has been installed on Nova 13 series, Nova Flip, and Nova 12 Pro.

Huawei is currently focusing on the Mate 70 series. The flagship lineup will likely launch next month with several new features as well as a powerful Kirin chip.

The device will further carry upgraded imaging features, improved and faster touch responses, and new satellite capabilities to enhance the user experience.

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On October 21, Qualcomm held the Snapdragon Summit 2024 where it launched the Snapdragon 8 Elite chipset. During the event, Honor came to the stage and showcased the Magic 7 series which gathered the spotlight for its impressive look.

Speaking of the design, the device is wrapped in a “Moon Shadow Gray” shade all around. The back panel reveals a marble-like pattern with a clean glossy finish.

The edges appear slightly curvy with a middle frame whereas the corners are round. Coming to the camera, the lens module has adopted the octagonal frame, just like the Magic V3 but differs slightly in terms of appearance.

The inner part of the camera shows a circular plate with squarely arranged lenses and an LED Flash at the top. Meanwhile, the front side shows a dual-hole display panel. It supports 3D face recognition and the ultrasonic fingerprint scanner.

Honor Magic 7 appears at the Snapdragon 8 Elite launch event (Image Credits: Honor/Weibo)

It would be worth seeing if the company has made any changes in the different variants of the Magic 7 series or adopted the same appearance for every model.

Honor has further confirmed that the Magic 7 series will be the first to equip Snapdragon 8 Elite. The new chipset is jointly developed by Honor and Qualcomm.

Snapdragon 8 Elite and AI

It claims to be the most powerful processor in the AI world and offers a robust performance to flagship smartphones. Consumers will witness far better functioning with the Magic 7 series over the previous-generation smartphones.

Zhao Ming – the CEO of Honor Devices delivered a short speech on Honor and Qualcomm cooperation. The executive revealed new native apps that will enhance the user experience in every aspect including performance as well as efficiency.

“Honor and Qualcomm work together to be at the forefront of edge AI development. As long-term partners, Honor and Qualcomm jointly develop and define new app scenarios in the AI era, bringing revolutionary experiences to users in connectivity, interaction, and performance.” – said Zhao Ming.

Honor Magic 7 appears at the Snapdragon 8 Elite launch event (Image Credits: Honor/Weibo)

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A recent report claimed that U.S. lawmakers are urging to impose more export controls on Huawei to restrict it from doing better in the chipset space.

The demand has come as Huawei is gearing up the development of its new Ascend 910C AI chip and an alleged 5nm processor for the upcoming Mate 70 flagship.

John Moolenaar and Raja Krishnamoorthi – members of the House Select Committee wrote a letter to Commerce Secretary Gina Raimondo on this matter.

They demanded tougher restrictions on Huawei. Doing so will be a sign that the U.S. will take strict actions to prevent its technology from being indulged in problematic ambitions. U.S. authorities have been howling in the name of security for years and the current scenario is no exception to this matter.

Is the U.S. afraid of Huawei?

Do you know the reason why U.S. lawmakers want more limitations on Huawei? It is because they found that the company is teaming up with chip component suppliers that aren’t on the Entity List. For instance SawySure, Qingdao SiEn, and more.

Earlier Huawei tied up with the PXW Semiconductor company for its chip production. However, as the U.S. came to know about this collaboration, it chained PXW from accessing its advanced techs. Now it is planning the same for other firms.

More export controls and restrictions reflect growing fears among the US government about Huawei’s progress in the chipset sector. The company is making slow yet significant improvements in both smartphones and AI processors which seems a major concern for the US.

Well, that’s only one side of the story. In the fear of Huawei’s chip progress, the US is even probing other chipmakers for whether they are helping the Chinese tech giant in any manner. TSMC is the latest example which is now stuck in investigation.

• U.S. investigates TSMC on chip dealings with Huawei

A coin has two sides and so does this report. Those on the U.S. side will see these measures as a part of national security. Meanwhile, those supporting Huawei will say that the U.S. is under pressure as Huawei has started rising in the chip technology.

More export controls highlight US concerns over Huawei’s chipset progress (Image Credits: Huawei)

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DigitalChatStation noted that the Huawei Nova 13 Pro has appeared on the Geekbench platform. It has the model number MIS-AL00 and showed notable scores.

The device has obtained 997 points in the single-core test and 2900 points in the multi-core test. Huawei has listed the 12GB RAM variant on the performance platform. Judging from the chipset’s CPU architecture, it appears to be Kirin 8000.

Kirin 8000 has a “4+3+1” octa-core framework. It contains four 1.84GHz small, three 2.19GHz medium cores, and one large core with a frequency of 2.40GHz. It will likely be paired with the company’s self-developed Maleoon 910 GPU.

Earlier, many netizens predicted that the Huawei Nova 13 series would come with HarmonyOS 4.4 software system. Although the current listing and tipster’s words reveal that the new high-end lineup will run on the HarmonyOS 4.2 version.

Huawei Nova 13 Pro with Kirin 8000 chip listed on Geekbench (Image Credits: Geekbench)

The listing does not reveal any other information about the device apart from the chip details and model number. Huawei will reveal the accurate parameters of Nova 13 and 13 Pro on October 22. Till then, you can book the phone at VMall.

Weibo tipster further shared some key specifications of the Nova 13 Pro. We are already familiar with these details but let’s have a quick recall again.

Expected Specifications

The device could feature a 1.5K equal-depth quad-curved display panel for a sleek design and improved image clarity. It may bring a pill-shape cutout with a dual-cam setup, just like the Huawei Nova 12 Pro. One of these lenses could be 60MP.

The rear side will bear a 50MP RYYB main camera. Nova 13 Pro will also support two-way satellite SMS capability to help out users when stuck in a “no-network” area.

Most of these features appear similar to the Nova 12 Pro. It would be worth seeing what major changes the device will bring over its predecessors apart from the design segment.

Huawei Nova 13 Pro key specs (Image Credits: DigitalChatStation/Weibo)

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According to Reuters, the finance minister of South Korea, Choi Sang-mok said that the country is readying strict measures and rules to block chipset and technology leaks in the global market. It is preparing a big-data system as a major safety.

The new “big data” system will lead to useful and stricter rules with tougher punishments for culprits. The penalties under this system are unknown but it will eventually ensure full security of the business secrets and chip tech in the country.

“We will prevent illegal leaks of advanced technologies to raise the global competitiveness of our companies and strengthen technology leadership.” – said Choi.

South Korean government is taking such strict measures following the previous leak cases in the country. Inputs reveal that over 97 attempts have been made in the past five years to leak business secrets and chipset details to other countries.

As noted by the National Intelligence Service, 40 of these leaks were regarding chip manufacturing and its relevant parts. The good news is that these leaks didn’t achieve success. Or else, it would have led to a loss of $16.85 billion to the country.

In September, a South Korean official blamed for stealing chipmaking details from Samsung.  Thus, a few strict measures on this matter are quite necessary.

Over the years, South Korea established around 12 national strategic tech firms that can support the country financially. These include rechargeable batteries, aerospace and artificial intelligence, semiconductors, and more.

These industries also aim to protect and respond actively to global competition and help resolve supply chain problems. It would be worth seeing what new penalties South Korea will take on the chipset and tech leak matter.

South Korea to halt chipset and technology leak with strict measures (Image Credits: Samsung)

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DirectorShiGuan notes that the Huawei Mate 70 series Kirin chip is more expensive than the previous versions. It could range from 1100 to 1300 yuan ($157-186).

The price seems a bit similar to some foreign alternatives. For instance, the upcoming Snapdragon 8 Gen 4 may cost $190 whereas, Dimensity 9400 could priced at $155.

If all these price details are accurate, the next-gen Kirin processor might somewhat match its rivals’ pricing. Things aren’t confirmed at present. Thus, let’s take this input with a grain of salt and wait for official details.

Further detail reflects that Huawei is developing its new Kirin chip with more high-end technologies, ensuring better performance. The forthcoming processor will likely run on a 5nm process technology. An official confirmation awaits on this topic.

Huawei Mate 70 series Kirin chip rumored to be expensive (Image Credits: Weibo)

Huawei is reportedly struggling with chip production and the shortage of advanced chipmaking tools. Hence, a 5nm chipset introduction with the Mate 70 still feels like a dream to many consumers. The mist will get clear by the next month.

Some previous reports suggested that the upcoming Kirin chip could rival Snapdragon 8 gen 2 processors. It will offer a more significant boost in performance than the 9000s chipsets. Besides, the processor may unveil several new capabilities.

The company is expected to use a robust CPU architecture that can improve the GPU performance. It may also unlock enhanced gaming and numerous AI services to ease the day-to-day tasks and efficiency aspects of the new smartphones.

Huawei may unveil the Mate 70 series with a new Kirin chip and the most-awaited HarmonyOS NEXT in November. The company hasn’t confirmed the details yet. Although we may soon get more info on this matter after the HarmonyOS NEXT public beta program. Stay tuned for more revelations on this subject.

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BeijingDigitalMaster notes that Huawei has significantly improved the smartphone chipmaking process. The overall Kirin efficiency is better than before.

The tipster further implied that the upcoming Huawei Kirin phones will likely deliver 30% better GPU performance. Its energy efficiency will also be much better than the previous versions, ensuring lower power consumption even during heavy tasks.

GPU stands for Graphics Processing Unit. It helps in generating high-quality images and makes app transitions faster. The component also enhances the CPU efficiency and speed of performing multiple operations such as gaming, rendering, and more.

Huawei currently uses the Maleoon 910 GPU for its devices which supports up to 4 CUs (Control Units) and 1024 ALUs (Arithmetic Logic Units). The company initially used this GPU with the Mate 60 series and continued with the other devices.

Future Huawei Kirin phones could offer 30% better GPU performance (Image Credits: Weibo)

As per the latest input, the company will optimize the GPU performance to a greater extent. Changes will likely be visible with the flagship Mate 70 series. Users might observe more efficiency while performing heavy tasks, playing games, or watching high-quality videos on the upcoming Huawei smartphones.

At the same time, the company is also enhancing the GPU power for its PCs. A previous leak suggested that Huawei is enhancing the GPU efficiency for its future notebooks.

Consumers may also find new AI services that will make their daily operations easier and more convenient. The company has recently launched the all-new MateBook GT 14 with a discrete GPU chip and the improvement could exceed to a new level with the upcoming PCs.

Let’s wait and see what new changes the company will add to its Kirin chips to deliver a better-than-before experience to users.

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A new leak suggests the uncertainty of the Kirin PC launch this year. Weibo tipster @BeijingDigitalMaster says that Huawei might delay the release of the Kirin PC chip by Q1 2025. And we have some reasons that justify the delay to some extent.

The Chinese OEM already has several major launches this year. For instance, this month will likely bring the Nova 13 series, a new MatePad tablet, the Sound X4, a smart Hi MateBook laptop, and of course, the HarmonyOS NEXT public beta program.

Next month is also seemingly full of big surprises like the stable HarmonyOS NEXT rollout, the flagship Mate 70 series, the Mate X6 dual-foldable phone, and more.

Huawei might have saved some interesting offerings for December as well. Thus, there are chances that the company may unveil its computer-dedicated software and chip in early 2025. Though the tech giant hasn’t mentioned any details on this matter.

Huawei Kirin PC chip might be delayed till Q1 2025 (Image Credits: Weibo)

A recent leak said that Huawei may launch the HarmonyOS PC in the next six months. Perhaps the company may debut the Kirin PC chip at the same time.

Early inputs predicted that the Kirin PC would follow the Apple M-series chip architecture. This framework includes all the main parts like DRAMs and SoCs in one package, doubling the memory bandwidth and performance efficiency. Read More… 

Apart from the new CPU architecture, the chipset is also expected to bring the latest AI features for notebooks, making them a smarter upgrade over previous versions.

The Kirin PC will also focus on better thermal control capabilities. Being the first self-developed laptop chip, it could be slightly less power efficient than the phone processors. Although Huawei may bring better changes in the time ahead.

You can check more news and details of the Kirin PC chip HERE.

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DigitalChatStation notes that the Honor Magic 7 series is set to launch next month. The company accelerated the flagship’s development and could soon announce the launch time. The lineup may also bring major software improvements than before.

Further input reveals the Magic 7 series could clash with Xiaomi 15 in the next month. The exact launch time is still unclear. But we may grab the details on this matter in the coming days.

Apart from launch inputs, the tipster implies the Honor Magic 7 series may use Snapdragon 8 Gen 4. The octa-core chip will uproot on a 3nm process technology. It may sport 2 cores of Oryon clocked at 4.9GHz and 6 cores of Oryon at 2.78GHz.

Based on these inputs, the Honor Magic 7 series may launch in October with the Snapdragon 8 Gen 4 chipset. Note that the company hasn’t confirmed these details yet. Hence, we have to wait for an official announcement on this matter.

Honor Magic 7 series may launch in October with Snapdragon 8 Gen 4 (Image Credits: Weibo)

Honor has also confirmed to launch the X60 smartphone in October. The exact date is still a mystery. Although the company may unveil the device after the Chinese Day holidays (October 1 to 7), that is mid-October.

If the above information is correct, consumers may receive two new Honor smartphone offerings next month. Let’s wait for more revelations on this subject.

Honor Magic 7 series will be a powerful upgrade over its predecessors. Why? Well, the flagship lineup will feature an all-new AI Agent with many amazing capabilities.

• Read More: Honor says Magic 7 will bring all AI features unlike iPhone 16

The device will adopt two different looks: one for standard and Pro variants while the other for Ultimate model. The first one said to adopt a circular camera ring on the back whereas, the second design could show a hexagonal or an octagonal shape.

Magic 7 series may also support new camera features such as 100x zoom, a self-developing imaging system, and more.

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Huawei recently launched the world’s first triple foldable phone – Mate XT. The amazing dual-hinge and Z folding factor have immensely amazed consumers.

On the other hand, the tri-fold fanned curiosity about its chip. The Chinese tech giant hasn’t shared the Mate XT processor details so far. Although a tipster said that the device runs on the Kirin 9010 – the same SoC found in the Pura 70 Ultra handset.

The tri-fold’s chip secrecy made eager for Huawei and China’s success in the semiconductor field. Many industry analysts even wondered if the company has made any chipset breakthrough with the first innovative tri-folding smartphone.

However, the case is seemingly the opposite. A new report says that Huawei is still struggling to master the performance of its new Kirin chipset. It is so as the company still relies upon DUV lithography machines due to the tough U.S. trade export controls.

DUV takes around 34 steps in processing whereas, EUV completes the chip fabrication in just 9 steps. It has a light wavelength of 13.5nm which is 14 times less than DUV. With outdated equipment, it is difficult to achieve next-level chip performance.

Huawei need to work on performance breakthrough for next Kirin chipset (Image Credits: Huawei)

Production is another issue. The Kirin chip shortage has been an all-time problem for the company. It slowed down the production of the Mate 60 series and is also expected as one of the major causes behind the Mate 70 smartphone series delay.

A recent EUV patent by a Chinese firm (SMEE) suggests that Huawei may soon get relief in the advanced chip-making process. But again, this won’t be possible as early as the next year or 2026. You can check the complete report HERE.

Everything combined, Huawei needs to work on performance breakthroughs for the next Kirin processor. The OEM may achieve this goal by the Mate 70 launch.

Huawei will introduce the Mate 70 series in November probably. The flagship lineup will likely bring a new Kirin 5G chip on board. Based on the current report, it would be worth seeing how much better the upcoming Kirin chip will be than its predecessors.

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